Chassis material |
High strength galvanized steel plate gray/black |
Chassis button |
Front switch, LED hard disk indicator, LED system indicator, DVD optional |
Overall size |
482.6*453*177 mm 4U Standard shelf type |
Platform configuration |
a main board |
Compatible with Micro-ATX motherboard Standard ATX motherboard |
CPU |
sustain LGA1155 3th
Intel Corerm
3/i5/i7/Celeron/Penti um processor |
sustain LGA1150 4th
IntelR Corerm
i3/i5/i7/Celeron/Penti
um processor |
sustain Intel LGA1151
6/7/8/9th i3/i5/i7/i9
Pentium/Celeron processor |
sustain Intel LGA11516/7/8/9th i3/i5/i7/i9Pentium/Celeron processor |
Chipset |
H61/B75 Chipset |
O87/B85/H81 Chipset |
Intel H110 Chipset |
Intel B365 Chipset |
internal storage |
DDR3/DDR3L 1333/1600 dual-channel support up to 16GB |
2xDDR4 DIMM memory slot, single 16GB, maximum 32GB |
4*DDR4-DIMM supports a maximum of 16GB and 64GB |
storage |
4*SATA2.0 |
1*SATA 3
1*(default MSATA, optional SSD of M.2-2242/2280 SATA bus) |
5 * Standard 7Pin SATAII interface
1 * M.2 interface, SATA3.0 (Moyi) |
support system |
XP,WIN7,8,10,LINUX |
WIN7,8,10,LINUX |
USB |
prepose2*USB2.0
postposition 6*USB2.0 |
prepose 2*USB2.0
postposition 4*USB2.0,2*USB3.0 |
prepose 2*USB2.0
postposition 2*USB2.0,4*USB3.0 |
prepose 2*USB2.0
postposition 6*USB3.0 |
Serial port |
2*RS232/422/485+4*RS232 |
2*RS232/422/485+5*RS232 |
2*RS232/485+2*RS232/485+2*RS232 |
Network interface |
1*Intel 82583V;
1*82579V
10/100/1000 Mbps |
2*i211 10/100/1000
Mbps |
1*IntelI219LM
1*Intel I211AT |
Built-in 2*Intel WGI211AT10M/100M/1000M
Support network wake-up |
PS joggle |
1*PS/2 keyboard/mouse interface |
Display interface |
1*VGA 1*HDMI |
1*VGA
I*HDMI
1*DVI |
1*VGA
1*HDMI |
expand |
1*PCIeX16 1*PCIeX4(X4 & X1 co-Lay)5*PCI |
1*PCIeX16 1*PCIeX4 1*PCIeX1 4*PCI(PCIe to PCI) |
1*PCIe x16,2*PCIe x1(x4 Connector,x1 signal)4*PCI(32bit) |
1*PCIe x16
2*PCIeX4
4*PCI |
LPT Parallel port |
Optional |
1*LPT |
Optional |
Optional |
audio frequency |
Mic in, Line in;Line_out |
Mic-in, Line-out |
working temperature |
0°C~50°C ;5%~90%(Non-condensing state) |
Storage environment |
-20°C~60°C;5%~90%( Non-condensing state) |