Chassis material |
High strength galvanized steel plate (black) |
Chassis button |
Front switch, LED hard disk indicator, LED system indicator, reset switch |
Overall size |
482*400*88.5mm 2U Standard rack mounting |
Platform configuration |
a main board |
Micro-ATX motherboard Standard ATX motherboard |
CPU |
sustain LGA1155 3th
Intel® CoreTm
i3/i5/i7/Celeron/Pentiu
m processor |
sustain LGA1150 4thIntel® CoreTm
i3/i5/i7/Celeron/Pentium processor |
sustain Intel LGA11516/7/8/9th i3/i5/i7/i9
Pentium/Celeron processor |
sustain Intel LGA11516/7/8/9th i3/i5/i7/i9Pentium/Celeron processor |
Chipset |
H61/B75 Chipset |
Q87/B85/H81 Chipset |
Intel H110 Chipset |
Intel B365 Chipset |
internal storage |
DDR3/DDR3L
1333/1600 dual-channel maximum
Support 16GB |
DDR3/DDR3L
1333/1600 Dual channel maximum support 16GB |
2xDDR4 DIMM memory slot, single 16GB, maximum 32GB |
4*DDR4-DIMM supports a maximum of 16GB and 64GB |
storage |
4*SATA2.0 |
1*SATA 3
1*(default MSATA, optional SSD of M.2-2242/2280 SATA bus) |
5*Standard 7Pin SATAIII interface
1*M.2 interface,SATA3.0 (default) |
support system |
XP,WIN7,8,10,LINUX |
WIN7,8,10,LINUX |
USB |
prepose 2*USB2.0
postposition 6*USB2.0 |
prepose 2*USB2.0
postposition 4*USB2.0,2*USB3.0 |
prepose 2*USB2.0
postposition 2*USB2.0,4*USB3.0 |
prepose 2*USB2.0
postposition 6*USB3.0 |
Serial port |
2*RS232/422/485+4*RS232 |
2*RS232/422/485+5*RS232 |
2*RS232/485+2*RS232/485+2*RS232 |
Network interface |
1*Intel 82583V:
1*82579V 10/100/1000Mbps |
2*i211 10/100/1000
Mbps |
1*IntelI219LM
1*Intel I211AT |
Built-in 2*Intel WGI211AT10M/100M/1000M support network wake-up |
PS interface |
1*PS/2 Keyboard/mouse interface |
Display interface |
1*VGA,1*HDMI |
1*VGA,1*HDMI1DVI |
1*VGA,1*HDMI |
expand |
1*PCIeX16
1*PCIeX4(X4 & X1
co-Lay)
5*PCI |
1*PCIeX16
1*PCIeX4
1*PCIeX1
4*PCI(PCIe to PCI) |
1*PCIe x16,
2*PCIe x1( x4 Connector,x1signal )
4*PCI(32bit) |
1*PCIe x16,2*PCIeX44*PCI |
LPT parallel port |
Optional |
1*LPT |
Optional |
audio frequency |
Mic in, Line_in;Line_out |
Mic-in, Line-out |
working temperature |
0°C~50°C;5%~90%( Non-condensing state ) |
Storage environment |
-20°C~60°C;5%~90%(Non-condensing state ) |